



接口丰硕,可选配GMSL/POE/DIO职能扩大板, 支持4G/5G/WiFi
接口隔离设计,加强了通讯抗滋扰能力
超低温启动(带自动加热?椋
宽温设计,支持-40~70℃工作温度
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Items |
Description |
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Processor Module |
Nvidia Jetson Orin NX 16G, AI Performance: 156TOPS INT8 |
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CPU |
8-core Arm® Cortex®-A78AE v 8.2 64-bit 2.0Ghz CPU 2MB L2 + 4MB L3 |
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GPU |
NVIDIA Ampere architecture with 1024 NVIDIA® CUDA® cores and 32 Tensor Cores |
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Memory |
16GB 256-bit LPDDR5 102 GB/s |
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Storage |
M.2 2280, PCIe Gen4, 256G/512G/1T/2T SSD |
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2.5" SATA Driver Bay x 1 |
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OS Support |
NVIDIA JetPack 6.2 |
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Display |
HDMI 2.0, support 1080P@60Hz |
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I/O Configuration |
2x 1GbE (100/1000M BASE-T) |
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2x USB3.0 Type-A, 1x USB2.0 Type-C (for firmware update) |
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4x GMSL2 (Optional) |
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4x 1GbE POE (Optional, 802.3 at,4xGMSL & 4x POE 只能同时扩大其中一种?) |
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3x DB9 ( 1x CAN FD, 2x RS232/422/485) |
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8x DIO (optional, 4x DI, 4x DO) |
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RF |
1x NVMe M.2 slot for WiFi-5/6/7 module |
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1x NVMe M.2 slot for 4G/5G Module |
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Dimensions |
Device Physical dimension: 240x154x84(mm) Mainboard Physical dimension: 184x150x25(mm) |